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BDN09-3CB

Part Number

BDN09-3CB

Manufacturer

CTS Thermal Management Products

Description

HEATSINK CPU .91" SQ

BDN09-3CB Specifications

Category	Thermal-Heat-Sinks
Manufacturer	CTS Thermal Management Products
Series	BDN
Package	Box
RoHS	RoHs
Type	Top Mount
Shape	Square, Pin Fins
Width	0.910" (23.11mm)
Length	0.910" (23.11mm)
Diameter	-
Material	Aluminum
Fin Height	0.355" (9.02mm)
Part Status	Active
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Material Finish	Black Anodized
Attachment Method	Thermal Tape, Adhesive (Not Included)
Thermal Resistance @ Natural	26.90°C/W
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	9.60°C/W @ 400 LFM

BDN09-3CB Description

M2S1 -intemational certificate of ls0 9001 quality management system, provides electronic components BDN09-3CB, allare 10% original and genuine, BDN09-3CBorovides 30 davs warranty,with fastest transpotation service BDN09-3CB's stock is 748,the manufacturer of BDN09-3CB is CTS Thermal Management Products, and the Package/Case of BDN09-3CB is Tray. Moreover, the eariest stock quantity updated of BDN09-3CB is 2026/6/24 For more information about BDN09-3CB, orthe price of BDN09-3CB.

Shipping Information

USPS, FedEx, DHL, and UPS could be selected.
Express: (FEDEX, UPS, DHL, TNT)Free shipping upon order amount and less than 0.5Kg , Overweight will be charged separately.
It is available for users to select "Freight Collect"depending on their requirement.
It may cost additional remote fees for delivery if you are in a remote area.
If you have any questions about shipping costs, you can write to us and we will confirm it manually.
For in-stock parts, orders normally could be shipped out within 1-2days.
Delivery date: usually 2 to 5 working days.
Shipping Tracking Number will be sent by email or contact us after order for details.

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