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ACC-HS3-SET

Part Number

ACC-HS3-SET

Manufacturer

Enclustra FPGA Solutions

Description

ACC HEATSINK ME ACC-HS3

ACC-HS3-SET Specifications

Category	Thermal-Heat-Sinks
Manufacturer	Enclustra FPGA Solutions
Series	ACC-HS3
Package	Box
RoHS	RoHs
Type	-
Shape	Rectangular
Width	1.063" (27.00mm)
Length	2.205" (56.00mm)
Diameter	-
Material	-
Fin Height	0.571" (14.50mm)
Part Status	Active
Package Cooled	-
Material Finish	-
Attachment Method	Bolt On
Thermal Resistance @ Natural	-
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	-

ACC-HS3-SET Description

M2S1 -intemational certificate of ls0 9001 quality management system, provides electronic components ACC-HS3-SET, allare 10% original and genuine, ACC-HS3-SETorovides 30 davs warranty,with fastest transpotation service ACC-HS3-SET's stock is 136,the manufacturer of ACC-HS3-SET is Enclustra FPGA Solutions, and the Package/Case of ACC-HS3-SET is Tray. Moreover, the eariest stock quantity updated of ACC-HS3-SET is 2026/5/30 For more information about ACC-HS3-SET, orthe price of ACC-HS3-SET.

Shipping Information

USPS, FedEx, DHL, and UPS could be selected.
Express: (FEDEX, UPS, DHL, TNT)Free shipping upon order amount and less than 0.5Kg , Overweight will be charged separately.
It is available for users to select "Freight Collect"depending on their requirement.
It may cost additional remote fees for delivery if you are in a remote area.
If you have any questions about shipping costs, you can write to us and we will confirm it manually.
For in-stock parts, orders normally could be shipped out within 1-2days.
Delivery date: usually 2 to 5 working days.
Shipping Tracking Number will be sent by email or contact us after order for details.

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